2025先进封装手册：制程技术

MKS Advanced Packaging Handbook Summary

Purpose

The handbook explores advanced packaging technologies to sustain performance gains in the post-scaling era of semiconductors. As traditional transistor scaling faces physical limits, advanced packaging enables the integration of multiple heterogeneous dies into a single package, supporting applications like AI, high-performance computing, and mobile devices.

Key Technologies

• Heterogeneous Integration: Involves chiplet architectures, allowing different process nodes and materials for specialized functions, improving cost-effectiveness and scalability.
• 2.5D/3D Architectures: Include interposer types (e.g., organic, silicon, glass) and interconnect technologies like Through Silicon Vias (TSVs), Redistribution Layers (RDLs), and flip chip bonding.
• Process Flows: Covers wafer-level packaging (e.g., Fan-Out WLP), panel-level packaging, and system-in-package (SiP) for high-density interconnects.
• Materials and Manufacturing: Discusses organic laminates, copper metallization, and chemical processes for substrate fabrication, with focus on environmental protection, thermal management, and signal integrity.

Applications and Benefits

• AI and High-Performance Computing: Requires high bandwidth memory and efficient heat dissipation, enabled by advanced packaging.
• Mobile and IoT Devices: Facilitates compact, low-power designs with enhanced I/O density, such as antenna-in-package (AiP) modules for 5G.
• Automotive and Aerospace: Ensures robustness and reliability in harsh environments.

Industry Impact

• Addresses Moore's Law limitations by promoting more than Moore's Law principles through heterogeneous integration.
• Reduces time-to-market and costs, with companies like MKS providing integrated solutions for interconnect optimization.
• Technology roadmap emphasizes ongoing innovation in systems and devices, driven by consortia like IEEE and Semiconductor Research Corporation.