2023-06-07-智研咨询-一文了解中国PCB行业发展现状及未来趋势_附产业政策_产业链全景_发展历程_市场供需_12页_732kb

PCB Industry Development Summary

The Chinese PCB (Printed Circuit Board) industry is a cornerstone of the electronics sector, with applications in various fields. Key aspects include:

• Definition and Classification: PCBs connect electronic components; classified by material flexibility (rigid, flexible, rigid-flex), layer count (single, double, multi-layer, including HDI and IC载板), or applications (e.g., consumer, communication, automotive).

• Policy Environment: Government policies, such as those supporting 5G, new energy vehicles, and industrial upgrades, encourage PCB development through fiscal incentives and market growth.

• Development History: The industry has evolved through four phases since 1956, from initial research to high-end development, with China becoming the world's largest producer by 2006.

• Current Status: China dominates global PCB production, with 2021产值 reaching $776.9 billion and a market size of 4307.55 billion yuan. Multi-layer boards are the mainstream, with trends toward high-density and advanced boards like HDI.

• Supply Chain: The chain involves upstream materials (e.g., copper foil, glass fiber) produced domestically, and downstream applications in communication, computing, and emerging sectors. Production growth in electrolytic copper foil and glass fiber supports the industry.

• Market Concentration: The market features intense competition among foreign and domestic firms, with low concentration, as evidenced by limited market share of top companies like鹏鼎控股.

• Future Trends: Expectations include a shift toward Western China for manufacturing, accelerated industry consolidation due to cost pressures, and advancements in high-density, flexible PCBs to meet demands from 5G, AI, and IoT.